HSR-1500 Non-Silicon Thermal Pad has an ideal filler blend that gives it a low-modulus characteristic,
which maintains optimal thermal performance yet still allows for easy handling. The natural tack on both
sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
HSR-1500 Thermal Silicone Pad Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type
of heat spreader
HSR-1500 Thermal Conductive Silicone Gasket Configurations Available:
• Sheet form and die-cut parts
It can replace Bergquist GP1500,Bergquist GAP PAD 1500,Laird Tflex300
