BERGQUIST GP1500 GAP PAD TGP 1500 GAP PAD 1500
BERGQUIST GAP PAD 1500 Thermally Conductive, Unreinforced Gap Filling Material
BERGQUIST GAP PAD TGP 1500 has
an ideal filler blend that gives it a low-
modulus characteristic, which maintains
optimal thermal performance yet still
allows for easy handling. The natural
tack on both sides of the material
allows for good compliance to adjacent
surfaces of components, minimizing
interfacial resistance.
BERGQUIST GP1500
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type
of heat spreader
Configurations Available:
• Sheet form and die-cut parts
