BERGQUIST SP900S SIL PAD TSP 1600S Formerly known as SIL PAD 900S
High Performance Insulator for Low-Pressure Applications
BERGQUIST SP900S Features and Benefits
• Thermal impedance: 0.61°C-in. 2 /W
(at 50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution
The true workhorse of the SIL PAD product family, BERGQUIST SIL PAD TSP 1600S thermally conductive
insulation material is designed for a wide variety of applications requiring high thermal performance and
electrical isolation. These applications also typically have low mounting pressures for component clamping.
BERGQUIST SIL PAD 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressures.
