BERGQUIST HI-FLOW THF 1600P consists of a thermally conductive 55°C phase
change compound coated on a thermally conductive polyimide film. The polyimide
reinforcement makes the material easy to handle and the 55°C phase change
temperature minimizes shipping and handling problems.
BERGQUIST HF300P achieves outstanding values in voltage
breakdown and thermal performance. The product is supplied on an easy release
liner for exceptional handling in high volume manual assemblies. BERGQUIST
HI-FLOW 300P is designed for use as a thermal interface material between
electronic power devices requiring electrical isolation to the heat sink.
