BERGQUIST GF3500S35 GAP FILLER TGF 3600 Formerly known as GAP FILLER 3500S35
Thermally Conductive Liquid Gap-Filling Material
Thermal paste of BERGQUIST GF3500S35 is a two-component, liquid gap-filling material, cured at either room or elevated
temperature, featuring ultra-high thermal performance and outstanding softness.Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity. The result is a gel-like liquid material designed
to fill air gaps and voids yet flow when acted upon by an external force (e.g., dispensing or assembly process). The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low modulus elastomer designed to assist
in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface.Thermal paste of BERGQUIST GAP FILLER TGF 3600 will lightly adhere to surfaces, thus improving surface area contact. BERGQUIST GAP FILLER 3500S35 is not designed to be a structural adhesive.
