Application:
?9?9 Desktop
Features:
?9?9 SolderBall, SMT Soldering
?9?9 Land Grid Array at Contract Side
Specification:
Mechanical:
?9?9 Pitch:0.914mm (X)×0.914mm (Y)
?9?9 Durability: 20 Cycles
Electrical:
?9?9 CurrentRating: Max. 0.3A / Pin
?9?9 Contact Resistance: Max. 25mΩ(Initial & Final)
Physical:
?9?9 Housing:LCP, Black, UL 94V-0
?9?9 Contact: Copper alloy
?9?9ILM Frame:Low carbon steel
?9?9ILM Load Plate: Stainless steel
?9?9ILM Load Lever:Stainless steel
?9?9Screw / Shoulder Screw: Low carbon steel
?9?9BackPlate: Low carbon steel
?9?9 Solder Ball:SnAgCu
?9?9PnP Cap: LCP, Black
?9?9Plating: Min. 15u” gold plating on contact area
?9?9OperatingTemperature:-25℃~105℃
Packaging:
?9?9 HardTray
